Talk:Chemical vapor deposition

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This article is too highly flawed for me to correct it in the short period of time I have at the moment.

Suffice to say this treatment of the topic of CVD is VASTLY oversimplified to the point of being incorrect. I made a minor alteration that fixes most of the problems.

The major problem here is that the article doesn't seem to differentiate between CVD, sputtering, MOCVD, PECVD etc.

Chemical vapor deposition is usually a fairly "high" temperature process, as the point is to cause a chemical reaction to preferentially occur on the surface by making it hot enough to decompose, or drive the reaction from the precursor gases to create your thin film. physical vapor deposition, or sputtering is what this article appears to be written from the perspective of, and it is not a CVD process, you use "high" energy gas particles to knock atoms off of a source which then impact the surface, resulting in a thin film of those dislodged atoms.

There are a number of other CVD like processes like microwave enhanced, or metal oxide cvd, that this article should also seek to differentiate generic CVD from. — This unsigned comment was added by 70.137.132.27 (talk • changes).